Journal of the Computational Structural Engineering Institute of Korea ISSN:1229-3059(Print) 2287-2302(Online) 한국전산구조공학회 논문집

In this study, viscoplastic material properties of solder alloy which is used in the electronics packages are inversely estimated. A specimen is fabricated to this end, and an experiment is conducted to examine deformation by Moiré interferometry. As a result of the experiment, bending displacement of the specimen and shear strain of the solder are obtained. A viscoplastic finite element analysis procedure is established, and the material parameters are determined to match closely with the experiments. The uncertainties which include inherent experimental error and insufficient data of experiments are addressed by using the method of computer model calibration. As a result, material parameters are identified in the form of confidence interval, and the displacements and strains using these parameters are predicted in the form the prediction interval.