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2016 Vol.29, Issue 6 Preview Page
2016. pp. 577-582
Abstract
References

REFERENCES

1
MA Bhuiyan, RV Pucha, M Karevan and K Kalaitzidou, Compos. Struct, Defining the Lower and Upper Limit of the Effective Modulus of CNT/ Polypropylene Composites through Integration of Modeling and Experiments, 95; 80-87 (2013)
10.1016/j.compstruct.2012.06.025
2
J Choi, H Shin, S Yang and M Cho, Compos. Struct, The Influence of Nanoparticle Size on the Mechanical Properties of Polymer Nanocomposites and the Associated Interphase Region: A Multiscale Approach, 119; 365-376 (2015)
10.1016/j.compstruct.2014.09.014
3
J Choi, S Yang, S Yu and M Cho, Polymer, The Glass Transition and Thermoelastic Behavior of Epoxy-Based Nanocomposites: A Molecular Dynamics Study, 52(22); 5197-5203 (2011)
10.1016/j.polymer.2011.09.019
4
J Choi, S Yang, S Yu, H Shin and M Cho, Polymer, Method of Scale-Bridging for Thermoelasticity of Cross-Linked Epoxy/SiC Nanocomposites at a Wide Range of Temperatures, 53(22); 5178-5189 (2012)
10.1016/j.polymer.2012.08.041
5
WK Goertzen and MR Kessler, J. Appl. Polymer Sci, Thermal Expansion of Fumed Silica/Cyanate Ester Nanocomposites, 109; 647-653 (2008)
10.1002/app.28071
6
J-S Jang, B Bouveret, J Suhr and RF Gibson, Polymer Compos, Combined Numerical/Experimental Investigation of Particle Diameter and Interphase Effects on Coefficient of Thermal Expansion and Young’s Modulus of SiO2/Epoxy Nanocomposites, 33(8); 1415-1423 (2012)
10.1002/pc.22268
7
SS Ray and M Okamoto, Progress in Polymer Sci, Polymer/Layered Silicate Nanocomposites: A Review from Preparation to Processing, 28; 1539-1641 (2003)
10.1016/j.progpolymsci.2003.08.002
8
DK Shin and JJ Lee, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Effective Material Prperties and Thermal Stress Analysis of Epoxy Molding Compound in Electronic Packaging, 21(4); 413-421 (1998)
10.1109/96.730426
9
HS Shin, SH Yang, SY Yu, SM Chang and MH Cho, J. Comput. Struct. Eng. Inst. Korea, A Study on the Sequential Multiscale Homogenization Method to Predict the Thermal Conductivity of Polymer Nanocomposites with Kapitza Thermal Resistance, 25(4); 315-322 (2012)
10.7734/coseik.2012.25.4.315
10
SH Yang, SY Yu and MH Cho, J. Comput. Struct. Eng. Inst. Korea, A Study on the Development of Multiscale Bridging Method Considering the Particle Size and Concentration Effect of Nanocomposites, 22(4); 343-348 (2009)
Information
  • Publisher :Computational Structural Engineering Institute of Korea
  • Publisher(Ko) :한국전산구조공학회
  • Journal Title :Journal of the Computational Structural Engineering Institute of Korea
  • Journal Title(Ko) :한국전산구조공학회 논문집
  • Volume : 29
  • No :6
  • Pages :577-582
  • Received Date : 2016-11-03
  • Revised Date : 2016-11-09
  • Accepted Date : 2016-11-14
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